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| Availability: | |
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| Quantity: | |
| Place of Origin | China |
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| Brand Name | Rps-sonic |
| Certification | CE |
| Model Number | RPS-SI60 |
| Minimum Order Quantity | 1pcs |
| Price | negotiable |
| Packaging Details | CARTON |
| Delivery Time | 1DAYS |
| Payment Terms | T/T |
Parameter
| model No. | RPS-SI60 |
| Ultrasonic frequency | 60Khz |
| Power | 100w |
| Temperature Range | 150 ~ 400 °C |
| Power Supply | 220V / 50-60 Hz |
| Generator Feature | Ultrasonic Amplitude Adjustable |
| Iron Handle Length & Diameter | 190mm / Ø20 |
| Avail Soldering Matrial | ITO Glass, AL, Mo, Cu etc., |
Description
Ultrasonic soldering is a flux-free soldering method. Compared with traditional soldering methods, it is considered more environmentally friendly. Use vibration and cavitation to remove the surface oxide layer from the welding surface instead of chemical agents.
Ultrasonic soldering technology is different from ultrasonic plastic welding, which uses vibration to generate heat to melt the connected parts. The principle of ultrasonic soldering is basically the same as that of ultrasonic cleaning. The vibration energy causes cavitation in the water bath or cleaning solvent. The surface of the part immersed in the liquid medium is cleaned by the strong erosion effect of cavitation bubbles.
Glass, ceramic, stainless steel, aluminum welding
In years of extensive research on glass-metal bonding, Japanese engineers have developed a special solder alloy called CERASOLZER (solder wire). This active solder alloy is specially formulated for the ultrasonic welding method and has a very unique bonding ability, which can replace the commonly used silver baking, indium brazing, molybdenum manganese and resin bonding methods. CERASOLZER chemical bond (glass substrate) In addition to the direct metal-to-metal bond, Cerasolzer can also form a strong chemical bond with the welded substrate. The alloy is composed of the same main components like a standard solder alloy (lead/tin), but in addition it also contains a small amount of elements such as zinc, titanium, silicon, aluminum, beryllium, rare earths, etc. These elements have the same effect as oxygen. Very strong chemical affinity.
During the welding process, these additional elements combine with the surrounding oxygen to form an oxide, which is chemically combined with various materials, including glass, ceramics, aluminum, stainless steel, conductive oxides, and many other previously used oxides. Other substrates that are considered non-weldable. The resulting oxide is combined with the solder substrate, forming a very strong chemical bond (RO) at the interface.
Therefore, if oxygen is effectively eliminated by replacing the air around the bonding equipment with an inert gas (such as nitrogen), the adhesion of the Cerasolzer will be lost. The results show that the appropriate critical oxygen concentration for bonding is about 2%. The melting temperature of Cerasolzer alloy is between 155 and 297℃. Due to ultrasonic vibration, the welding method is flux-free. In fact, if our ultrasonic welding method uses flux, it will destroy the oxygen bond and destroy the entire welding process, so it should not be used.
Application
Glass jewelry manufacturing
Optical glasses coating/metallization
Making electrodes on glass and ceramic plates
Welding of heating contacts on the rear window of a car
Welding superconductors, components, ceramic accessories
Vacuum sealing of glass tube, bonding of hardware accessories
Sealing of optical glass fiber (metal ferrule bonding)
The electrode is bonded to the front/back contact of the solar cell (crystalline, thin film)
Bonding leads (dots) in metallic glass, liquid crystal glass, crystal oscillator, hybrid integrated circuit
Parameter
| model No. | RPS-SI60 |
| Ultrasonic frequency | 60Khz |
| Power | 100w |
| Temperature Range | 150 ~ 400 °C |
| Power Supply | 220V / 50-60 Hz |
| Generator Feature | Ultrasonic Amplitude Adjustable |
| Iron Handle Length & Diameter | 190mm / Ø20 |
| Avail Soldering Matrial | ITO Glass, AL, Mo, Cu etc., |
Description
Ultrasonic soldering is a flux-free soldering method. Compared with traditional soldering methods, it is considered more environmentally friendly. Use vibration and cavitation to remove the surface oxide layer from the welding surface instead of chemical agents.
Ultrasonic soldering technology is different from ultrasonic plastic welding, which uses vibration to generate heat to melt the connected parts. The principle of ultrasonic soldering is basically the same as that of ultrasonic cleaning. The vibration energy causes cavitation in the water bath or cleaning solvent. The surface of the part immersed in the liquid medium is cleaned by the strong erosion effect of cavitation bubbles.
Glass, ceramic, stainless steel, aluminum welding
In years of extensive research on glass-metal bonding, Japanese engineers have developed a special solder alloy called CERASOLZER (solder wire). This active solder alloy is specially formulated for the ultrasonic welding method and has a very unique bonding ability, which can replace the commonly used silver baking, indium brazing, molybdenum manganese and resin bonding methods. CERASOLZER chemical bond (glass substrate) In addition to the direct metal-to-metal bond, Cerasolzer can also form a strong chemical bond with the welded substrate. The alloy is composed of the same main components like a standard solder alloy (lead/tin), but in addition it also contains a small amount of elements such as zinc, titanium, silicon, aluminum, beryllium, rare earths, etc. These elements have the same effect as oxygen. Very strong chemical affinity.
During the welding process, these additional elements combine with the surrounding oxygen to form an oxide, which is chemically combined with various materials, including glass, ceramics, aluminum, stainless steel, conductive oxides, and many other previously used oxides. Other substrates that are considered non-weldable. The resulting oxide is combined with the solder substrate, forming a very strong chemical bond (RO) at the interface.
Therefore, if oxygen is effectively eliminated by replacing the air around the bonding equipment with an inert gas (such as nitrogen), the adhesion of the Cerasolzer will be lost. The results show that the appropriate critical oxygen concentration for bonding is about 2%. The melting temperature of Cerasolzer alloy is between 155 and 297℃. Due to ultrasonic vibration, the welding method is flux-free. In fact, if our ultrasonic welding method uses flux, it will destroy the oxygen bond and destroy the entire welding process, so it should not be used.
Application
Glass jewelry manufacturing
Optical glasses coating/metallization
Making electrodes on glass and ceramic plates
Welding of heating contacts on the rear window of a car
Welding superconductors, components, ceramic accessories
Vacuum sealing of glass tube, bonding of hardware accessories
Sealing of optical glass fiber (metal ferrule bonding)
The electrode is bonded to the front/back contact of the solar cell (crystalline, thin film)
Bonding leads (dots) in metallic glass, liquid crystal glass, crystal oscillator, hybrid integrated circuit
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