What Is Ultrasonic PCB Atomization Spraying?

Ultrasonic PCB atomization spraying uses ultrasonic technology to atomize liquid coatings and then spray them onto the surface of printed circuit boards (PCBs). It is primarily used to protect circuits, prevent short circuits, and improve soldering quality. The following is a brief introduction:

●Technical Principle: High-frequency current excites piezoelectric ceramics, converting electrical energy into mechanical energy. This generates high-frequency oscillations with micron-level amplitudes at the tip of the spray nozzle. Ultrasonic vibrations overcome surface tension in the liquid, breaking it into uniform droplets with a diameter of 10-40μm. The atomized droplets are then transported by low-pressure carrier gas to the PCB surface, where they are deposited non-contact to form a coating.

● Process Advantages:

    ○ Excellent Coating Uniformity: Achieves highly uniform coatings on both tiny electronic components and large PCBs, keeping coating uniformity tolerances within ±5%, improving PCB performance stability and reliability.

    ○ High Production Efficiency: Completes large-area PCB spray coating operations in a short time, shortening production cycles. A high solution conversion rate of ≥95% reduces solution usage and improves production efficiency.

    ○ Environmentally Friendly: No high-pressure air is required, reducing liquid rebound and splashing. Paint utilization is typically over four times that of conventional air spray, reaching up to over 90%, reducing volatile organic compound (VOC) emissions and meeting green manufacturing standards.

    ○ Wide Applicability: Ultrasonic spray systems offer flexibility and compatibility, adapting to different PCB materials and coating requirements. Different nozzle specifications and models can be selected based on coating properties, coating requirements, and substrate shape.

   ○ Stable Spraying: Ultrasonic atomizing nozzles atomize the solution into nano-sized particles, which evenly deposit on the substrate, are resistant to nozzle clogging, and offer high controllability.

●Application Scenarios: Primarily used for coating PCB surfaces with flux to prepare for subsequent soldering processes, ensuring soldering quality and reducing problems like cold solder joints and short circuits. It can also be used to apply nano-coatings and insulating coatings to PCB surfaces, providing protection against moisture, corrosion, and salt spray, thereby increasing the lifespan and reliability of PCBs.